Polyimide Tape

Polyimide tape

Description: 

Polyimide consisting of a polyimide film and silicone adhesive designed for high temperature masking applications, including the protection of  gold edge fingers and edge connectors during wave soldering and reflow soldering processes within the PCB assembly industry. It is used in electrical insulation application meeting class H requirements.

Main Features: 

. Thin and conformable enabling masking of uneven sufaces.

. Wide operaturing tempreture range up to 500°F.

. Excellent electrical insulation

. Remove clearly without adhesive residue after exposure to heat/chemical

Applications: 

. Masking for protection of gold fingers and edge connectors during wave soldering and reflow soldering processes  or solder dip process within the PCB assembly industry.

. Release surface in fabrication of parts cured at elevated temperatures.

. Widely used for electrical insulation on transformer, motor, coil, PCB masking and so on.

Linered polyimide tape

Description:

Linered polyimide tape consists of a PET Fluorosilicone Release liner with polyimide film and silicone adhesive designed for die-cut high temperature masking dots, used for protection of gold fingers and edge connectors during wave soldering and reflow soldering processes or solder dip processes of PCB assembly industry. It is used in electrical insulation application meeting class H requirement.

Main Feartures:

. Wide operating temperature range up to 500℉.

. Excellent electrical insulation.

. Remove clearly without adhesive residue after exposure to heat or chemicals.

Application:

Used for die-cut polyimide dots.

Polyimide dots

Description:

This part die cuts from linered polyimide tape, consisting a PET Fluorosilicone release liner with polyimide film and silicone adhesive designed for protection of gold fingers and edge connectors during wave soldering and reflow soldering processes within the PCB assembly industry.

Features:

. Wide operating temperature range up to 500℉.

. Remove clearly without adhesive residue after exposure to heat or chemical.

Application:

. Masking gold finger and edge connectors of PCB.

. Protecting surface during high temperature powder coating.

. Other high temperature protection applications.